Dr. Cohen
Prof. Bar-Cohen began his professional career
at the Raytheon Company in Massachusetts in
1968 and since then has been involved
in the design, analysis, and optimization of
thermal systems, with emphasis on the thermal
packaging of electronic equipment. He has lectured
widely, published extensively in the archival
heat transfer and packaging literature, and
taught many Short Courses on this subject, both
at universities and major conferences in the
US and abroad. He is a Fellow of ASME and
of IEEE and serves as the Editor of the IEEE
Transactions on Components and Packaging Technologies
Prof. Bar-Cohen
served as General Manager and Executive Consultant
for packaging and physical modeling at Control
Data Corporation, 1984-1989, held a succession
of academic appointments, from Lecturer to Professor,
in the Department of Mechanical Engineering
at the Ben Gurion University of the Negev (Israel),
1973-1988, held the Sweatt Chair in Technological
Leadership at the University of Minnesota, where
he also served as the Director of the Center
for the Development of Technological Leadership
from 1997 to 2002 and Professor of Mechanical
Engineering from 1992 to 2002. In the past he
also held faculty positions at the Massachusetts
Institute of Technology, 1977-1978, and the
Naval Postgraduate School, 1982.
In
1988 Prof. Bar-Cohen was the founding chairman of
the ASME/IEEE Intersociety Conference on Thermal
Phenomena in Electronic Systems (ITHERM) and
chaired the 2nd ITHERM Conference in 1990. Among
other responsibilities, he served as the General
Chairman for the first InterPack (International
Intersociety Packaging Conference) in 1995;
chaired the International Advisory Committee
of the 1997 Electronic Packaging Technology
Conference in Singapore, and was Chairman of
the International Conference on Heat Exchangers
for Sustainable Development, June 1998 in Lisbon,
Portugal and Co-Chair of New and Renewable Technologies
for Sustainable Development, July 2000 in Madeira,
Portugal. He has also participated in organizing
numerous technical sessions at ASME's NHTC,
InterPack, and IMECE (WAM) Conferences, as well
as at IEEE, IEPS, SPIE, ITHERM, Eurotherm, ICHMT,
and other international Conferences and Workshops
in Europe and Asia. In 1993 he was invited by
the UN to lecture and consult to the electronics
industry in India. In 1998 he was elected
to the Scientific Council of the International
Center for Heat and Mass Transfer (ICHMT), headquartered
in Turkey. Prof. Bar-Cohen currently serves on the
Steering Committee of the ASME Nanotechnology
Institute and is Chair of the US Scientific
Committee of the International Heat Transfer
Assembly (1998-2002).
Prof. Bar-Cohen is co-author (with A.D. Kraus) of
Design and Analysis of Heat Sinks (1995)
and Thermal Analysis and Control of Electronic
Equipment (1983) and has co-edited nine
books in this field, including the ASME Press
Series Advances in Thermal Modeling of Electronic
Components and Systems and the John Wiley
& Sons Series in Thermal Management of
Microelectronic and Electronic Systems.
He has authored and co-authored some 75 Journal
papers, 115 Refereed Proceedings papers, and
32 chapters in books, and has delivered 40 keynote,
plenary, and invited lectures at major technical
Conferences and Institutions.
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