This is an advanced level course, and a perfect follow-up to our introductory course, Practical Electronics Cooling: Analysis, Modeling & Measurement. You will learn how to streamline your thermal design with tricks from the experts at Applied Thermal Technologies and Fluent, Inc. They will demonstrate how to combine analytical methods and modeling techniques efficiently, in order to design appropriate cooling solutions for your systems. With this knowledge, you will be able to develop and analyze successful cooling strategies more quickly.

The importance of CFD/CAD tools in thermal design of an electonic system will be explained in this course. You will learn when to use these tools, how to create an appropriate model of an electronic system, and how to optimize your cooling solution.

Who Will Benefit:
This course is recommended for thermal, mechanical, and design engineers working in the electronics industry.

Course Fee:
Registration fee of $700 per person includes one day of lectures, a comprehensive set of notes, lunch and refreshments.

Registration fee of $1100 per person for a course combining Practical Electronics Cooling: Analysis, Modeling & Measurements and its follow-up, Advanced Electronics Cooling: Analysis, Modeling & Measurements includes two days of lectures, a comprehensive set of notes, lunch and refreshments.

Course Outline:
Thermal Design Process

Analytical Techniques
Natural Convection Example
Forced Convection Exapmple
Package Level Example
Thermal Resistance of a Typical PGA Package

Thermal Analysis of a Multi-Chip Module

Heat Sink Desing and Optimization
Environmental and Physical Conditions
Initial Feasibility Study
Preliminary Heat Sink Desing
Heat Sink Optimization

Heat Sink Design Using QFin

Numerical Techniques
CAD Tools in Electronics Cooling; Benefits and Limitations
Types of CAD Tools; Conduction-Only Tools and CFD Tools
Board Level Design
System Desing

Case Study: Evaluation of Airflow Prediction Methods in Compact Electronic Enclolsures
Airflow Prediction Methods: Experimental, Performance Curve, and CFD
Effect of Grille Open Area
Change in Fan Size
Fan is Series and Parallel

Case Study: Thermal Design of a Telecom Product
Initial Desing Concept
Desing Goals, Potential Concepts, Desing Parameters
Preliminary CFD Model of System
Study Variation of the Base Model
Aiorflow Testing and Veification
Design Optimization
CPU Board Modeling
Heat Sink Design and Optimization

Questions, Answers and Discussion