This popular, one-day course presents a practical and systemathic approach in finding cooling solutions for electronic systems. It introduces you to the analytical, modeling and experimental tools for solving electronics cooling problems at the component, board, and system levels. You will learn how to use these tools in solving your own electonic cooling problems.

Who Will Benefit:
Product design engineers (EEs and MEs) involved with the design of electronic components, PCBs and electronic & telecommunication equipment
Manufacturing personnel
Quality engineers
Reliability engineers
Packaging, electronics and design engineers
Research and development specialists
Laboratory managers
Mechanical engineers
Project managers
Quality control managers
Consultants

Course Fee:
Registration fee of $700 per person includes one day of lectures, a comprehensive set of notes, lunch and refreshments.

Registration fee of $1100 per person for a course combining Practical Electronics Cooling: Analysis, Modeling & Measurements and its follow-up, Advanced Electronics Cooling: Analysis, Modeling & Measurements includes two days of lectures, a comprehensive set of notes, lunch and refreshments.

Course Outline:
Introduction
Importance of Thermal Management
Principles of Thermal Management
Thermal Analysis and Design Process
Levels of Thermal Analysis

Fundamentals of Heat Transfer
Conduction
Convection
Radiation
Fins and Heat Sinks

Air Flow Management
Air Flow Requirement
Pressure Loss through a System
System Impedance Curve
Fan/Blower/Impeller Selection

Package Level Thermal Analysis
Package Thermal Resistance
Influence of Board Mounting on Package Thermal Resistance
Package Thermal Resistance versus Air Velocity
Heat Sink Thermal Resistance

Heat Sink Technologies
Types of Heat Sinks
Passive and Active Heat Sinks
Heat Sink Selection
Heat Sink Attachment and Interface Materials

Experimental Methods
Airflow measurement
System Impedance Curve Measurement
Fan Curve Measurement
Velcoity Measurement
Temperature Measurement