 | Technical Papers from Applied Thermal |
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Date |
Technical Papers |
| Feb 2008 | Telecom Equipments: Hard limiting factors and opportunities (presentation)
Farzam Roknaldin |
| Feb 2008 | Design and Optimization of Heat Sink for Quad Core Intel Processor using Qfin (presentation)
Vladimir Kudriavtsev |
| March, 2008 | Radiator Heat Sink Analysis for Heat Removal in High Performance Liquid Cooling Systems (presentation)
Vladimir Kudriavtsev |
| 2004 | The accuracy of Qfin when compared to standard CFD simulations for a typical high performance heat sink (presentation)
Dr Monem Alyaser |
| July 2004 | Cooling solutions for Next Generation High-Power Processor Boards in 1U Computer Servers
Farzam Roknaldin, Ridvan A. Sahan |
| April 2004 | Board level thermal analysis via Large Eddy Simulation
Farzam Roknaldin, Arunima Panigrahy |
| April 2004 | Do fan blades require cyclic pitch when in push configuration inside telecommunication chassis?
Farzam Roknaldi |
| June 2002 | COMPONENT SIZE AND EFFECTIVE THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS
Younes Shabany |
| June 2002 | A SIMPLIFIED CFD MODEL FOR THE RADIAL BLOWER
Farzam Roknaldin, Ridvan Amir Sahan, and Xiaohua Howard Sun |
| March 2000 | FAN SWIRL EFFECTS ON COOLING HEAT SINKS AND ELECTRONIC PACKAGES
Ernest Thurlow, Eric Prather, and Vivek Mansingh |
| March 1999 | EVALUATION OF AIRFLOW PREDICTION METHODS IN COMPACT ELECTRONIC ENCLOSURES
Rebecca Biswas, Raghu B. Agarwal, Avijit Goswami and Vivek Mansingh |
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Technical Papers from Applied Thermal - India |
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Effective heat pipe utilization in a heat sink.
Thermal management of a rack mounted telecommunication system.
Board level thermal analysis
Liquid cooling -Thermal analysis of a cold plate
Effect of obstruction near fan inlet on fan heat sink performance
Vivek Khaire and Avijit Goswami.
Evaluation of cooling solutions for outdoor electronics
Mahendra Wankhede, Vivek Khaire and Avijit Goswami.
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Technical Papers from Aavid Thermalloy (our parent company) |
| July 2007
Read about the latest cooling technologies for high heat flux applications in this paper given by Aavid's chief technology officer Sukhvinder Kang at InterPACK 2007 in Vancouver.
CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER
SYSTEMS
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| July 2005
Heat Sink Design Portal
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April 2003
Learn about some of the latest cooling solutions offered by Aavid Thermalloy for all new modules with high power density.
Comparative Analysis of Various Heatsink Technologies in Forced Ventilation
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| Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems 361k
Abstract (HTML)
Paper (PDF)
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| Analytical Modeling of Thermal Resistance in Bolted Joints 267k
Abstract (HTML)
Paper (PDF)
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| Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition 367k
Abstract (HTML)
Paper (PDF)
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| Constriction/Spreading Resistance Model for Electronics Packaging 425k
Abstract (HTML)
Paper (PDF)
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| How to Select a Heat Sink 212k
Abstract (HTML)
Paper (PDF)
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| Optimum Design and Selection of Heat Sinks 249k
Abstract (HTML)
Paper (PDF)
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| Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection 316k
Abstract (HTML)
Paper (PDF)
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| Thermal Performance of an Elliptical Pin Fin Heat Sink 317k
Abstract (HTML)
Paper (PDF)
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| Thermal Performance of Interface Material in Microelectronics Packaging Applications
Abstract (HTML)
Paper (PDF)
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| Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate 419k
Abstract (HTML)
Paper (PDF)
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Augmentation Improves Thermal Performance of Air Cooled Heat Sinks |
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Augmented-Fin Air-Cooled Heat Sinks Achieve Higher Performance Without Significant Rise in Static Pressure Drop |
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As Cool as a Cucumber—Managing the Heat Produced by IC Developments |
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Beat the Heat in Notebooks—with Software |
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How to Size Heat Sinks for Semiconductors |
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Larger Packages Fuel Thermal Strategies |
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Miniaturization of Cooling Solutions |
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The Basics of Package/Device Cooling— Various Cooling Methods are Available for Keeping Electronic Devices Within Their Operating Temperature Specifications. |
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Thermal Engineering Overview |
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Thermal Management of Electrolytic Capacitors |
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The Thermal Side of 64-bit Processing |
